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SelectConnect™ Metallization is an integral step producing 3D-MID (Molded Inter-connect Device) technology. This process can deposit layers of copper, nickel, and gold on LDS (Laser Direct Structured) of palladium activated polymeric traces to form circuit pathways on three-dimensional electronic structures. This allows designers and electrical engineers opportunity for miniaturization, cost savings by eliminating insert molding or circuit boards, and improved reliability.
The first step in making the 3D-MID is selecting the polymer from materials ranging from polycarbonate, polycarbonate-ABS blends, polybutylene terphtalate, to liquid crystal polymers and more. There are two approaches for the second step including Laser Direct Structuring of the circuit path onto the molded polymer or double shot molding with palladium added to the second shot. Third step is our SelectConnect™ Metallization Process where we will build electroless copper, electroless nickel, and immersion gold traces on the structured patterns to form the circuit path.
Arlington Plating Company can use the SelectConnect™ process to metallize patterned components in a plating cylinder (in bulk) or on a rack. Typical thickness ranges are 50-250 micro-inches of copper, 30-100 micro-inches of nickel, and 5-8 micro-inches of gold. The gold layer is optional providing improved bonding, solderablity, and contact resistance than the nickel finish alone.
Laser Direct Structuring (LDS) can be done with LPKF Laser & Electronics AG process. Successful applications for this process include cell phone antennas, automotive sensors, activators, and switches, electronic packaging, medical devices, and power sensors. Double Shot molding can be done with Phillips Plastics Corporation’s multi-shot molding capability with palladium catalyzation. Metallization can be done by Arlington Plating Company’s SelectConnect™ Process.